Static dissipative polyimide labels withstand wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.

• Low-profile, high-temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner
• Surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008
• UL approved and meets requirements of MIL-STD-202G, Method 215K
• Service temperature of -94° to 212°F (-70° to 100°C)